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- Sizzix-Die Brush Tool. Designed to instantly remove leftover paper from chemically-etched dies, wafer-thin dies and cut out designs. The sleek, ergonomic rubber-grip handle allows for non-slip and easy maneuverability as it smoothly rolls away excess paper. This package contains 5-1/2×1-3/4×1-1/4 inch die brush tool and one 7×4- 1/2×1/2 inch foam pad. Imported.
Sizzix Accessory – Die Brush & Foam Pad for Wafer-Thin Dies
RM 59.90
- USD: $14.41
Sizzix Accessory – Die Brush & Foam Pad for Wafer-Thin Dies
3 in stock
Weight | 0.20 kg |
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Dimensions | 18.00 × 18.00 × 3.00 cm |
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